BES2800HP

BES next-generation AI edge flagship with dual-core Cortex-M55 + HiFi4 DSP + BECO NPU, WiFi6+BT5.4, 8.3MB SRAM, 6nm process.

🤖 AI Edge Flagship🏅 6nm Process📶 WiFi6 + BT5.4

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BES next-generation AI edge flagship with dual-core Cortex-M55 + HiFi4 DSP + BECO NPU, WiFi6+BT5.4, 8.3MB SRAM, 6nm.

Specifications

CPU	Dual-core Cortex-M55@200MHz + dual-core STAR-MC1@128MHz
DSP	Tensilica HiFi 4 @ 200MHz
NPU	BECO NPU
SRAM	8.3MB
Flash	16/20MB SiP
WiFi	802.11ax (WiFi6) dual-band
Bluetooth	Bluetooth 5.4 dual-mode + LE Audio
TX	BDR/Bluetooth LE 16dBm
RX	BDR -97dBm / Bluetooth LE -101dBm
DAC	2ch high-quality DAC
ANC	FF+FB Hybrid 45dB@200Hz, <9μs
Audio	24bit, spatial audio, active crossover

Key Features

WiFi6+BT5.4 Dual-Band8.3MB Massive SRAM6nm Flagship ProcessSpatial AudioHiFi4 DSP

Applications

›AI Edge Devices
›Flagship TWS
›Smart Speakers
›Edge Computing

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The chip and module part numbers, trademarks and technical documentation shown on this page belong to their respective manufacturers and rights holders. Shenzhen GTAI Technology Co., Ltd. provides distribution and technical support; specifications are subject to the manufacturer's datasheet.

The product categories and solutions shown on this page are supported by Shenzhen GTAI Technology Co., Ltd. through solution design, chip supply, PCBA manufacturing and ODM/OEM services. The end products listed are manufactured, marketed and sold by brand customers or ODM/OEM customers under their own names, and those customers are responsible for the applicable product compliance, including radio type approval and Bluetooth qualification.

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