BES2700H

BES flagship TWS SoC with dual-core STAR-MC1 @208MHz + dual-core BECO NPU, adaptive hybrid ANC up to 45dB.

🏆 Flagship TWS SoC🧠 Dual-Core + NPU🔇 Adaptive ANC 45dB

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BES flagship TWS SoC with dual-core STAR-MC1@208MHz + dual-core BECO NPU, adaptive hybrid ANC 45dB.

Specifications

CPU	Dual-core STAR-MC1 @ 208MHz + dual-core BECO NPU
SRAM	2.2MB shared
Flash	4/8MB SiP
Bluetooth	Bluetooth 5.3 dual-mode + LE Audio
TX	BDR 14dBm / Bluetooth LE 14dBm
RX	BDR -95.5dBm / Bluetooth LE -100dBm
DAC	2ch 110dB SNR, 384K sampling
ADC	5ch 103dB SNR, 384K sampling
ANC	Adaptive hybrid ANC 45dB@200Hz, <9μs latency
AI	BECO NPU, AI voice, low-power VAD
Package	BGA 219-pin 5.7×6.2mm

Key Features

Dual-Core + NPU ArchitectureAdaptive Hybrid ANC 45dBLE AudioAI Voice

Applications

›Branded TWS Earbuds
›AI Edge
›High-Quality Audio

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Compliance note

The chip and module part numbers, trademarks and technical documentation shown on this page belong to their respective manufacturers and rights holders. Shenzhen GTAI Technology Co., Ltd. provides distribution and technical support; specifications are subject to the manufacturer's datasheet.

The product categories and solutions shown on this page are supported by Shenzhen GTAI Technology Co., Ltd. through solution design, chip supply, PCBA manufacturing and ODM/OEM services. The end products listed are manufactured, marketed and sold by brand customers or ODM/OEM customers under their own names, and those customers are responsible for the applicable product compliance, including radio type approval and Bluetooth qualification.

The Bluetooth® word mark and logos are owned by Bluetooth SIG, Inc. Any end product bearing these marks must be qualified by that product's brand owner before the marks may be used.