BES2600Z

BES mid-to-high-end TWS SoC in a compact BGA108 6.7×3.6 package, for TWS earbuds and smart speakers.

🎧 Mid-High TWS SoC📦 BGA108 Compact🎵 Audio DSP

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BES mid-to-high-end TWS SoC in a compact BGA108 6.7×3.6 package.

Specifications

Package	BGA108 6.7×3.6
Positioning	Mid-to-High-End TWS

Key Features

Compact PackageMid-to-High-End Positioning

Applications

›TWS Earbuds
›Mid-to-High-End Audio

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Compliance note

The chip and module part numbers, trademarks and technical documentation shown on this page belong to their respective manufacturers and rights holders. Shenzhen GTAI Technology Co., Ltd. provides distribution and technical support; specifications are subject to the manufacturer's datasheet.

The product categories and solutions shown on this page are supported by Shenzhen GTAI Technology Co., Ltd. through solution design, chip supply, PCBA manufacturing and ODM/OEM services. The end products listed are manufactured, marketed and sold by brand customers or ODM/OEM customers under their own names, and those customers are responsible for the applicable product compliance, including radio type approval and Bluetooth qualification.

The Bluetooth® word mark and logos are owned by Bluetooth SIG, Inc. Any end product bearing these marks must be qualified by that product's brand owner before the marks may be used.